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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
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without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. 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the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos integrated circuit pd168002 monolithic 6-channel h-bridge driver data sheet document no. s16040ej1v0ds00 (1st edition) date published november 2003 ns cp(k) printed in japan 2002 description the pd168002 is a monolithic 6-channel h-bridge driver that consists of a cmos contro l circuit and a mos output stage. it can reduce the current consum ption and the voltage loss at the output stage compared with conventional driver using bipolar transistors, thanks to employment of a mos process. the pd168002 employs p-channel mos fet in the output stage, and is eliminated the charge pump circuit. therefor e, the circuit current consumption during operation can be significantly reduced. the package is a 48-pin tqfp that helps reduce the mounting area and height. the pd168002 can be used to drive one stepping motor and four dc motors, and is suitable for the motor driver of cd-rom/cd audios. features ? six h-bridge circuits employing power mos fet ? low current consumption due to elimination of charge pump circuit ? input logic frequency: 100 khz supported ? 3 v power supply supported for logic minimum operating supply voltage: 2.7 v ? 5 v, 10 v power supply supported for motor ch1, ch2, ch5 and ch6: 10 v driving ch3 and ch4: 5 v driving ? undervoltage lockout circuit shuts down the internal circuit at v dd = 1.7 v typ. ? overheat protection circuit ? 48-pin tqfp ( 7 mm) ordering information part number package pd168002ga-9eu 48-pin plastic tqfp (fine pitch) (7 x 7)
data sheet s16040ej1v0ds 2 pd168002 1. block diagram pgnd out 2a v m2 out 2b pgnd out 1a v m1 out 1b pgnd in 1a in 1 /in 1b en 12 /in 2a in 2 /in 2b in 3a in 3b in 4a in 4b v dd in 5a in 5b in 6a in 6b sel 12 stb 12 sled h-bridge 2 h-bridge ch1 to ch2 control circuit 48 1 37 36 24 25 13 12 h-bridge ch3 to ch6 control circuit spindle h-bridge 5 loading h-bridge 6 pgnd out 4a v m4 out 4b pgnd out 3a v m3 out 3b pgnd stb 6 stb 5 stb 34 (nc) (nc) lgnd pgnd out 5a v m5 out 5b pgnd out 6a v m6 out 6b pgnd sled h-bridge 1 tracking h-bridge 4 focus h-bridge 3 cautions 1. be sure to connect all of the pins which have more than one. 2. a pull-down resistor (50 to 200 k ) is internally connected to the logic input pins. logic input pins: in 1a , in 1 /in 1b , en 12 /in 2a , in 2 /in 2b , in 3a , in 3b , in 4a , in 4b , in 5a , in 5b , in 6a , in 6b , sel 12 , stb 12 , stb 34 , stb 5 and stb 6 3. the power supply pins for motor, v m1 and v m2 , v m3 and v m4 , and v m5 and v m6 , are connected each other inside. these pins must be applied from the same potential.
data sheet s16040ej1v0ds 3 pd168002 2. pin functions package: 48-pin plastic tqfp (fine pitch) (7 x 7) (1/2) pin no. pin name function 1 in 2 /in 2b ch2 input pin or ch2 input pin b 2 in 3a ch3 input pin a 3 in 3b ch3 input pin b 4 in 4a ch4 input pin a 5 in 4b ch4 input pin b 6 v dd logic power supply pin 7 in 5a ch5 input pin a 8 in 5b ch5 input pin b 9 in 6a ch6 input pin a 10 in 6b ch6 input pin b 11 sel 12 ch1 and ch2 input logic selection pin 12 stb 12 ch1 and ch2 standby pin 13 stb 34 ch3 and ch4 standby pin 14 stb 5 ch5 standby pin 15 stb 6 ch6 standby pin 16 pgnd gnd pin 17 out 3b ch3 output b 18 v m3 ch3 power supply pin 19 out 3a ch3 output a 20 pgnd gnd pin 21 out 4b ch4 output b 22 v m4 ch4 power supply pin 23 out 4a ch4 output a 24 pgnd gnd pin 25 pgnd gnd pin 26 out 6b ch6 output b 27 v m6 ch6 power supply pin 28 out 6a ch6 output a 29 pgnd gnd pin 30 out 5b ch5 output b 31 v m5 ch5 power supply pin 32 out 5a ch5 output a 33 pgnd gnd pin 34 lgnd gnd pin 35 (nc) unused caution be sure to c onnect all of the pins which have more than one .
data sheet s16040ej1v0ds 4 pd168002 (2/2) pin no. pin name function 36 (nc) unused 37 pgnd gnd pin 38 out 2a ch2 output a 39 v m2 ch2 power supply pin 40 out 2b ch2 output b 41 pgnd gnd pin 42 out 1a ch1 output a 43 v m1 ch1 power supply pin 44 out 1b ch1 output b 45 pgnd gnd pin 46 in 1a ch1 input pin a 47 in 1 /in 1b ch1 input pin or ch1 input pin b 48 en 12 /in 2a ch1 and ch2 control pin or ch2 input pin a caution be sure to c onnect all of the pins which have more than one.
data sheet s16040ej1v0ds 5 pd168002 3. standard connection example pgnd out 2a v m2 out 2b pgnd out 1a v m1 out 1b pgnd in 1a in 1 /in 1b en 12 /in 2a in 2 /in 2b in 3a in 3b in 4a in 4b v dd in 5a in 5b in 6a in 6b sel 12 stb 12 48 1 37 36 24 25 13 12 pgnd out 4a v m4 out 4b pgnd out 3a v m3 out 3b pgnd stb 6 stb 5 stb 34 (nc) (nc) lgnd pgnd out 5a v m5 out 5b pgnd out 6a v m6 out 6b pgnd m sled motor spindle motor loading motor 8 v 3 v m m focus coil tracking coil 5 v sled h-bridge 2 sled h-bridge 1 h-bridge ch1 to ch2 control circuit h-bridge ch3 to ch6 control circuit spindle h-bridge 5 loading h-bridge 6 tracking h-bridge 4 focus h-bridge 3 caution this diagram is the exampl e of connection and is not what was created as a purpose of mass production.
data sheet s16040ej1v0ds 6 pd168002 4. function operation table 4.1 relationship between sel pin and input pins sel pin 46-pin 47-pin 48-pin 1-pin l unused ch1 input pin in 1 ch1 and ch2 control pin en 12 ch2 input pin in 2 h ch1 input pin in 1a ch1 input pin in 1b ch2 input pin in 2a ch2 input pin in 2b remark l: low level, h: high level 4.2 ch1 and ch2 inpu t/output truth table (1) sel 12 = l input output output status en 12 in out a out b l x z z stop (output high impedance) h l h l forward revolution (out a out b ) h h l h reverse revolution (out b out a ) remark x: high level or low level, z: output high impedance (2) sel 12 = h input output output status in a in b out a out b l l l l stop (short brake) l h l h reverse revolution (out b out a ) h l h l forward revolution (out a out b ) h h h h stop (short brake) 4.3 ch3 to ch5 input/output truth table input output output status in a in b out a out b l l l l stop (short brake) l h l h reverse revolution (out b out a ) h l h l forward revolution (out a out b ) (h) (h) (h) (h) stop (short brake) caution at ch3 to ch5, inputting in a = h and in b = h prohibits. 4.4 ch6 input/output truth table input output output status in a in b out a out b l l l l stop (short brake) l h l h reverse revolution (out b out a ) h l h l forward revolution (out a out b ) h h h h stop (short brake)
data sheet s16040ej1v0ds 7 pd168002 5. standby function the pd168002 realizes a standby function by combination of an input signal. the specified output is set to high impedance (hi-z) status by setting stb to low level. each pin can be independently controlled, and can be set to standby status of the self current consumption of the ic reduced as much as possible by setting all pins to low level. in the standby status, the overheat protection circuit and the undervoltage lockout circuit do not operate. pin function output status when pin = l ch1 ch2 ch3 ch4 ch5 ch6 stb 12 sled block standby hi-z hi-z on on on on stb 34 focus and tracking block standby on on hi-z hi-z on on stb 5 spindle block standby on on on on hi-z on stb 6 loading block standby on on on on on hi-z remark on: status which can turn on output, hi-z: high impedance 6. operation waveform examples (1) example of the clockwise revolution of the right figure when 2-phase diving (2) example of the counter-clockwise revolution of the right figure when 2-phase diving phase a in (in 1 ) phase b in (in 2 ) phase a in (in 1 ) phase b in (in 2 ) out b out a out a out b out a out b out b out a ch2 ch1 (1) (2) <1> <1> <2> <3> <4> <1> <2> <3> <4> <1> <1> <4> <3> <2> <1> <4> <3> <2> <1> <4> <2> <3> remark sel 12 = l, en 12 = h
data sheet s16040ej1v0ds 8 pd168002 7. electrical specifications absolute maximum ratings (t a = 25 c, glass epoxy board of 100 mm x 100 mm x 1 mm with copper foil area of 15%) parameter symbol condition rating unit power supply voltage v dd control block ? 0.5 to +6.0 v v m motor block (ch3 and ch4) ? 0.5 to +6.0 v motor block (ch1, ch2, ch5 and ch6) ? 0.5 to +12.0 v input voltage v in ? 0.5 to v dd + 0.5 v output pin voltage 1 v out1 motor block (ch3 and ch4) 6.2 v output pin voltage 2 v out2 motor block (ch1, ch2, ch5 and ch6) 12.2 v dc output current 1 i d(dc)1 dc (ch3 to ch5) 0.3 a/ch dc output current 2 i d(dc)2 dc (ch1, ch2 and ch6) 0.15 a/ch instantaneous output current 1 i d(pulse)1 pw < 10 ms, duty cycle 20% (ch3 to ch5) 0.6 a/ch instantaneous output current 2 i d(pulse)2 pw < 10 ms, duty cycle 20% (ch1, ch2 and ch6) 0.3 a/ch power consumption p t 1.0 w peak junction temperature t ch(max) 150 c storage temperature t stg ? 55 to +150 c caution product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. that is, the ab solute maximum ratings are rated valu es at which the product is on the verge of suffering physical damage , and therefore the product must be used under conditions that ensure that the absolute m aximum ratings are not exceeded. recommended operating conditions (t a = 25 c, glass epoxy board of 100 mm x 100 mm x 1 mm with copper foil area of 15%) parameter symbol condition min. typ. max. unit power supply voltage v dd control block 2.7 5.5 v v m motor block (ch3 and ch4) 2.7 5.5 v motor block (ch1, ch2, ch5 and ch6) 6.0 11.0 v input voltage v in 0 v dd v dc output current 1 i d(dc)1 dc (ch3 to ch5) ? 0.2 +0.2 a/ch dc output current 2 i d(dc)2 dc (ch1, ch2 and ch6) ? 0.1 +0.1 a/ch instantaneous output current 1 i d(pulse)1 pw < 10 ms, duty cycle 20% (ch3 to ch5) ? 0.4 +0.4 a/ch instantaneous output current 2 i d(pulse)2 pw < 10 ms, duty cycle 20% (ch1, ch2 and ch6) ? 0.2 +0.2 a/ch logic input frequency f in 100 khz operating temperature range t a ? 40 85 c
data sheet s16040ej1v0ds 9 pd168002 electrical characteristics (unless otherwise specified, t a = 25 c, v dd = 3 v, v m = 5 v (ch3 and ch4), v m = 8 v (ch1, ch2, ch5 and ch6) ) parameter symbol condition min. typ. max. unit v dd pin current in standby mode i dd(stb) all control pin: low level 1.0 a v dd pin current in during operation i dd(act) 1.0 ma v m pin current in during operation i m output with no load, in pin, en pin: low level 100 a high-level input current i ih v in = v dd 60 a low-level input current i il v in = 0 v ? 1.0 a input pull-down resistance r ind 50 200 k high-level input voltage v ih 2.7 v v dd 5.5 v 0.7 x v dd v low-level input voltage v il 2.7 v v dd 5.5 v 0.3 x v dd v h-bridge on-state resistance 1 (ch1, ch2 and ch5) r on1 i m = 0.1 a (ch1 and ch2), i m = 0.2 a (ch5), sum of upper and lower stages 2.0 3.0 h-bridge on-state resistance 2 (ch3 and ch4) r on2 i m = 0.2 a, sum of upper and lower stages 1.2 2.0 h-bridge on-state resistance 3 (ch6) r on3 i m = 0.1 a, sum of upper and lower stages 3.5 5.0 output leakage current i m(off) per v m pin, all control pin: low level (v m = max. value in the recommended range) 10 a low-voltage detection voltage v dds 1.7 2.5 v output turn-on time note t on2 i m = 0.1 a (ch1, ch2 and ch6), 0.2 0.6 2.0 s output turn-off time note t off2 refer to figure 7 ? 1. h-bridge switching waveform (when sel 12 = l) and figure 7 ? 2. h-bridge switching waveform (when sel 12 = h) . 0.05 0.3 1.0 s output turn-on time note t on1 i m = 0.2 a (ch3 to ch5), 0.05 0.15 1.0 s output turn-off time note t off1 refer to figure 7 ? 2. h-bridge switching waveform (when sel 12 = h) (only when v inb = l) . 0.05 0.2 1.0 s note for the turn-on time and the turn -off time, to fix one of two input pins to low level is conditions. remark the overheat protection circuit operates under t ch > 150c. all outputs goes high impedance in the protection status. note that t he overheat protection circuit and the undervoltage lockout circuit do not operate in the standby status.
data sheet s16040ej1v0ds 10 pd168002 switching characteristics waveform figure7 ? 1. h-bridge switch ing waveform (when sel 12 = l) 100% 0% 50% 90% 10% 50% 50% 10% ? 10% ? 50% ? 90% ? 90% ? 100% ? 50% ? 10% 10% 50% 90% 90% 0% 0% 100% 100% 50% 10% 90% 50% t on t off t f t r 100% t f t r t r t off t off t on t on t f i out v in i out en 12 remark the high impedance period of about 50 ns is prepared for the through-current prevention at the time of mode switching. the t r (rise time) is designed as 50 ns, and the t f (fall time) is designed as about 50 ns.
data sheet s16040ej1v0ds 11 pd168002 figure7 ? 2. h-bridge switch ing waveform (when sel 12 = h) 100% 10% 90% 10% 10% 90% 90% t on t off t f t r i out v ina i out v ina hi-z hi-z out 1a out 1b 100% 10% 90% 10% 90% 10% 90% t off t on t r t r out 1b out 1a out 1b out 1a brake when v inb = h note when v inb = l note the conditions of v inb = h is valid only at ch1, ch2 and ch6. the through current may be flowed, if the switching operation is performed under the conditions of v inb = h at ch3 to ch5. remark the high impedance period of about 50 ns is prepared for the through-current prevention at the time of mode switching. the t r (rise time) is designed as 50 ns, and the t f (fall time) is designed as about 50 ns.
data sheet s16040ej1v0ds 12 pd168002 8. package drawing s s n j detail of lead end r k m l p i s q g f m h 48-pin plastic tqfp (fine pitch) (7x7) note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. item millimeters a b d g 9.0 0.2 7.0 0.2 0.5 (t.p.) 0.75 j 9.0 0.2 k c 7.0 0.2 i 0.10 1.0 0.2 l 0.5 0.2 f 0.75 n p q 0.10 1.0 0.1 0.1 0.05 s48ga-50-9eu-2 s 1.27 max. h 0.22 + 0.05 ? 0.04 m 0.145 + 0.055 ? 0.045 r3 + 7 ? 3 36 37 24 48 1 13 12 25 cd a b
data sheet s16040ej1v0ds 13 pd168002 9. recommended soldering conditions the pd168002 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than thos e recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http: //www.necel.com/pkg/e n/mount/index.html) type of surface mount device pd168002ga-9eu: 48-pin plastic tqfp (fine pitch) (7 x 7) process conditions symbol infrared reflow package peak temperature: 235 c, time: 60 seconds max. (at 210 c or higher) , count: three times or less, exposure limit: none, flux: rosin flux with low chlori ne (0.2 wt% or below) recommended. ir35-00-3 caution do not use different soldering met hods together (except for partial heating) .
data sheet s16040ej1v0ds 14 pd168002 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed immediately after power-on for devices having reset function.
pd168002 reference documents nec semiconductor device reliability/ quality control system (c10983e) quality grades on nec semi conductor devices (c11531e) the information in this document is current as of november, 2003. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1

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